Ming Xu

Jiawei Zhang

Yongdong Li

Anbang Sun

This book presents articles from the 5th Chinese Conference on High Voltage and Discharge Plasmas, held in Xi'an, China by the Special Committee on Plasma and Its Applications of the Chinese Electrotechnical Society from November 29 to December 1, 2024. It facilitates the exchange and sharing of the latest research advances and major outcomes in the fields of high voltage technology, pulsed power, plasma, and related applications over the past two years. It is dedicated to enhancing academic exchanges between various disciplines, promoting interdisciplinary integration, and thereby advancing the development and technological progress in high voltage and discharge plasma technology sectors.

HVDP 2024, 29 Nov-1 Dec, Xi'an, China

Proceedings of the 5th Chinese Conference on High Voltage and Discharge Plasmas

Philip S. Yu

This book offers a clear and comprehensive introduction to broad learning, one of the novel learning problems studied in data mining and machine learning. Broad learning aims at fusing multiple large-scale information sources of diverse varieties together, and carrying out synergistic data mining tasks across these fused sources in one unified analytic. This book takes online social networks as an application example to introduce the latest alignment and knowledge discovery algorithms. Besides the overview of broad learning, machine learning and social network basics, specific topics covered in this book include network alignment, link prediction, community detection, information diffusion, viral marketing, and network embedding.

An Application on Social Networks

Broad Learning Through Fusions

Michael Pecht

Haleh Ardebili

Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics Includes coverage of environmentally friendly 'green encapsulants' Presents coverage of faults and defects, and how to analyze and avoid them

Encapsulation Technologies for Electronic Applications

Jiawei Zhang

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