Xiaobing Luo

Shen Liu

Since the first light-emitting diode (LED) was invented by Holonyak and Bevacqua in 1962, LEDs have made remarkable progress in the past few decades with the rapid development of epitaxy growth, chip design and manufacture, packaging structure, processes, and packaging materials. LEDs have superior characteristics such as high efficiency, small size, long life, low power consumption, and high reliability. The market for white LED is growing rapidly in various applications. It has been widely accepted that white LEDs will be the fourth illumination source to substitute the incandescent, fluorescent, and high-pressure sodium lamps. With the development of LED chip and packaging technologies, the efficiency of high power white LED will broaden the application markets of LEDs while changing the lighting concepts of our lives. In LED Packaging for Lighting Applications, Professors Liu and Luo cover the full spectrum of design, manufacturing, and testing. Many concepts are proposed for the first time, and readers will benefit from the concurrent engineering and co-design approaches to advanced engineering design of LED products. One of the only books to cover LEDs from package design to manufacturing to testing Focuses on the design of LED packaging and its applications such as road lights Includes design methods and experiences necessary for LED engineers, especially optical and thermal design Introduces novel LED packaging structures and manufacturing processes, such as ASLP Covers reliability considerations, the most challenging problem for the LED industry Provides measurement and testing standards, which are critical for LED development, for both LED and LED fixtures Codes and demonstrations available from the book’s Companion Website This book is ideal for practicing engineers working in design or packaging at LED companies and graduate students preparing for work in industry. This book also provides a helpful introduction for advanced undergraduates, graduates, researchers, lighting designers, and product managers interested in the fundamentals of LED design and production. Color version of selected figures can be found at www.wiley.com/go/liu/led

Design, Manufacturing, and Testing

LED Packaging for Lighting Applications

Yong Liu

Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging

Manufacturing, Reliability and Testing

Modeling and Simulation for Microelectronic Packaging Assembly

James Mcgree

Zongyuan Ge

Yang Xie

Due to the scale and complexity of data sets currently being collected in areas such as health, transportation, environmental science, engineering, information technology, business and finance, modern quantitative analysts are seeking improved and appropriate computational and statistical methods to explore, model and draw inferences from big data. This book aims to introduce suitable approaches for such endeavours, providing applications and case studies for the purpose of demonstration. Computational and Statistical Methods for Analysing Big Data with Applications starts with an overview of the era of big data. It then goes onto explain the computational and statistical methods which have been commonly applied in the big data revolution. For each of these methods, an example is provided as a guide to its application. Five case studies are presented next, focusing on computer vision with massive training data, spatial data analysis, advanced experimental design methods for big data, big data in clinical medicine, and analysing data collected from mobile devices, respectively. The book concludes with some final thoughts and suggested areas for future research in big data. Advanced computational and statistical methodologies for analysing big data are developed Experimental design methodologies are described and implemented to make the analysis of big data more computationally tractable Case studies are discussed to demonstrate the implementation of the developed methods Five high-impact areas of application are studied: computer vision, geosciences, commerce, healthcare and transportation Computing code/programs are provided where appropriate

Shen Liu

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