Modern Electroplating

A new collection of authoritative contributions on the state of the art of electrochemical deposition Since the last edition of Modern Electroplating was published over a quarter century ago, electrochemical deposition has evolved into a mature science, with many new and potential applications. To address these developments, Modern Electroplating, Fourth Edition presents an entirely new collection of contributions on a wide range of cutting-edge topics, from electrodeposition of semiconductors to environmental considerations. Geared to experienced deposition practitioners and novices alike, the new edition provides clear, thorough, up-to-date explanations of the principles and applications of highly relevant deposition techniques. It not only replaces the Third Edition, a very useful resource on electroplating processes, but, in addition, highlights the transition in the electronics industry from physical to electrochemical methods, especially with regard to next-generation technologies such as copper interconnect. Coverage includes: * Electrodeposition of various metals and metal alloys * Electrodeposition of semiconductors and electrodeposition on nonconductors * Electrodeposition of conductive polymers * Electroless deposition of various metals and alloys * Preparation procedures for deposition * Manufacturing technologies, monitoring, testing, and control * Deposition and the environment